Embedding passive electronic components into 3D printed structures using FDM technology

Abstract

In today's rapidly evolving world, industries are constantly seeking innovative new solutions to improve the functionality of their products, while also trying to reduce manufacturing costs and optimize prototype production time. During my university years, I believe that this is the perfect time to research these technologies, as it will help my professional development and allow me to gain a wealth of experience that I can put to good use in the future. The primary goal of my research is to develop a technological basis within 3D printing technology for integrating basic passive electronic components into the 3D printing process using FDM technology. At the same time, and perhaps the next big challenge, is the integration of these 3D-printed elements and components with products from other industries. That is why I believe that combining 3D printing with electronic components, such as passive electronic components, and ICs into the carrier structure (rather than putting them in the traditional way) offers significant advantages, as it allows manufacturers to create more compact, durable, and aesthetically pleasing products. To this end, I need to conduct research in the field of material compatibility, as I need to examine the materials most commonly used in 3D printing, which include PLA, PETG, and conductive filament, and how these materials affect temperature changes, assembly difficulty, embedding techniques, and component integrity. For later practical implementation, my project focuses on comparing and testing different embedding methods. These include, for example, interrupting the printing process to insert components (pause and insert), designing assemblable elements, and using electrically conductor filaments. These methods not only focus on passive components (resistors, capacitors, LEDs), but also analyse embedding processes, which are an important part of developing this technology. Overall, the research involves a thorough comparison of component parameters (e.g., LED brightness, actual resistance value after embedding) to draw the appropriate conclusions. The results of the analysis may contribute to the manufacture of complex, intelligent, small- batch products for everyday use, with electronics integrated into their mechanical structure, bringing us closer to the future of fully printable electronic devices.