Modeling lead-free interconnect reliability under creep in advanced packaging

xmlui.dri2xhtml.METS-1.0.item-contributor-advisor	Gonda, Viktor
Author	Vargas Cruz, Ramiro Sebastian
xmlui.dri2xhtml.METS-1.0.item-date-accessioned	2025-10-16T06:57:19Z
xmlui.dri2xhtml.METS-1.0.item-date-available	2025-10-16T06:57:19Z
xmlui.dri2xhtml.METS-1.0.item-date-issued	2025
xmlui.dri2xhtml.METS-1.0.item-identifier-uri	http://hdl.handle.net/20.500.14044/34816
dc.format	PDF	hu_HU
xmlui.dri2xhtml.METS-1.0.item-language	en	hu_HU
dc.subject	anyagtudomány	hu_HU
Title	Modeling lead-free interconnect reliability under creep in advanced packaging	hu_HU
xmlui.dri2xhtml.METS-1.0.item-title-alternative	n.a.	hu_HU
xmlui.dri2xhtml.METS-1.0.item-rights-access	Open access	hu_HU
xmlui.dri2xhtml.METS-1.0.item-rights	Óbudai Egyetem	hu_HU
xmlui.dri2xhtml.METS-1.0.item-local-dateDefence	2025
xmlui.dri2xhtml.METS-1.0.item-other-containerPublisherPlace	Budapest	hu_HU
local.doctoralSchool	Anyagtudományok és Technológiák Doktori Iskola	hu_HU
xmlui.dri2xhtml.METS-1.0.item-publisher-university	Óbudai Egyetem	hu_HU
xmlui.dri2xhtml.METS-1.0.item-subject-area	Műszaki tudományok - multidiszciplináris műszaki tudományok	hu_HU
xmlui.dri2xhtml.METS-1.0.item-type-type	Doktori (Ph.D.) értekezés / Ph.D. Thesis	hu_HU
local.tempfieldCollections	Disszertációk	hu_HU
xmlui.dri2xhtml.METS-1.0.item-description-version	Kiadói változat	hu_HU
xmlui.dri2xhtml.METS-1.0.item-format-page	98 p.	hu_HU