Modeling lead-free interconnect reliability under creep in advanced packaging

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URI
http://hdl.handle.net/20.500.14044/34816
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Title
Modeling lead-free interconnect reliability under creep in advanced packaging
xmlui.dri2xhtml.METS-1.0.item-title-alternative
n.a.
Author
Vargas Cruz, Ramiro Sebastian
xmlui.dri2xhtml.METS-1.0.item-date-issued
2025
xmlui.dri2xhtml.METS-1.0.item-date-defence
2025
xmlui.dri2xhtml.METS-1.0.item-contributor-advisor
Gonda, Viktor
xmlui.dri2xhtml.METS-1.0.item-rights-access
Open access
xmlui.dri2xhtml.METS-1.0.item-language
en
xmlui.dri2xhtml.METS-1.0.item-format-page
98 p.
xmlui.dri2xhtml.METS-1.0.item-description-version
Kiadói változat
xmlui.dri2xhtml.METS-1.0.item-type-type
Doktori (Ph.D.) értekezés / Ph.D. Thesis
xmlui.dri2xhtml.METS-1.0.item-subject-area
Műszaki tudományok - multidiszciplináris műszaki tudományok
xmlui.dri2xhtml.METS-1.0.item-publisher-university
Óbudai Egyetem